News

February 2017

Dr. Bakir received the 2016 Class of Course Survey Teaching Effectiveness Award

January 2017

Hanju and Xuchen received Best Oral Session Paper Award at ECTC

Nov 2016

Reza received Outstanding Abstract Achievement Award at American Society of Hematology

September 2016

Will received Best in Session Award at SRC TECHCON

May 2016

Reza received Best Poster Award at Annual User Science and Engineering Review from The Institute for Electronics and Nanotechnology (IEN)

April 2016

Joe Gonzalez awarded Goizueta Foundation Fellowship

March 2016

Muneeb Zia and Paul Jo received Best Team Award in NSF I-Corps in 2016 Winter Cohort

February 2016

Joe Gonzalez awarded GEM Fellowship

December 2015

Muneeb Zia and Paul Jo won NSF I-Corps Grant for 2016 Winter Cohort

November 2015

Microfluidic cooled FPGA featured in IEEE Spectrum.

November 2015

Reza Abbaspour won best student paper award at GIT 2015

October 2015

Microfluidic cooled FPGA featured in Georgia Tech news.

June 2015

M. Bakir was appointed as IEEE CPMT distinguished lecturer.

March 2015

James Yang and Chaoqi Zhang received the 2014 Best TCPMT journal paper award for Advanced Packaging.

Welcome to I3DS Group

End of Fall 2016 group lunch
Microfluidic cooled FPGA
Mechanicaly flexible interconnects
Gold plated mechanically flexible interconnects
High aspect ratio via in silicon
Electrical and microfluidic chip I/Os
Mechanicaly flexible interconnects

Welcome to I3DS group! The multidisciplinary Integrated 3D Systems (I3DS) Research Group at Georgia Tech explores the design, fabrication, and characterization of 3D electronic systems and advanced interconnect networks. Our mission is to explore the limits and opportunities for heterogeneous 3D electronic system integration enabled through novel interconnect structures. Specifically, we focus on the (co)design, fabrication, and characterization of chip-level electrical, optical, and thermal interconnect networks to solve the power delivery, off-chip signaling, and cooling needs of future many-core and memory 3D integrated systems. We also explore the 3D integration of sensor and MEMS devices with CMOS signal processing circuitry.