"@ARTICLE{11075902,
  author={Zhang, Zhonghao and Jo, Paul K. and Oh, Shane and Bakir, Muhannad S.},
  journal={IEEE Transactions on Components, Packaging and Manufacturing Technology}, 
  title={Direct Die-to-die Bridging for Heterogeneous mm-wave Circuits Enabled by Fused-Silica Stitch-Chip Technology}, 
  year={2025},
  volume={},
  number={},
  pages={1-1},
  keywords={Chiplets;Packaging;Integrated circuit interconnections;Substrates;Radio frequency;Device-to-device communication;Assembly;Silicon;Scalability;Multichip modules;Millimeter wave;RF packaging;fused silica;monolithic microwave integrated circuit (MMIC);transmission line;heterogeneous integration},
  doi={10.1109/TCPMT.2025.3587609}}"