"@INPROCEEDINGS{11038010,
  author={Zhang, Zhonghao and Zheng, Ting and Bakir, Muhannad},
  booktitle={2025 IEEE 75th Electronic Components and Technology Conference (ECTC)}, 
  title={High-Frequency Multi-Chip RF Module Enabled by Fused-Silica Stitch-Chip Technology: RF and Interconnect Characterization}, 
  year={2025},
  volume={},
  number={},
  pages={2230-2236},
  keywords={Radio frequency;Degradation;Chiplets;Simulation;Integrated circuit interconnections;Switches;Loss measurement;Stability analysis;Gain;Substrates;millimeter-wave;RF packaging;fused silica;monolithic microwave integrated circuit (MMIC);transmission line;heterogeneous integration},
  doi={10.1109/ECTC51687.2025.00379}}"