@article{kumar2016impact,
  title={Impact of on-chip interconnect on the performance of 3-D integrated circuits with through silicon vias: part I},
  author={Kumar, Vachan and Oh, Hanju and Zhang, Xuchen and Zheng, Li and Bakir, Muhannad S and Naeemi, Azad},
  journal={IEEE Transactions on Electron Devices},
  volume={63},
  number={6},
  pages={2503--2509},
  year={2016},
  publisher={IEEE}
}