@ARTICLE{1580600,
author={B. {Dang} and M. S. {Bakir} and J. D. {Meindl}},
journal={IEEE Electron Device Letters},
title={Integrated thermal-fluidic I/O interconnects for an on-chip microchannel heat sink},
year={2006},
volume={27},
number={2},
pages={117-119},
keywords={microfluidics;heat sinks;microprocessor chips;integrated circuit packaging;integrated circuit interconnections;thermal management (packaging);microfluidic heatsink;thermal-fluidic input/output interconnect;power dissipation;microprocessor;chip-level liquid cooling;thermal interface;IC chip;convective cooling medium;wafer-level integration;Microchannel;Heat sinks;Microfluidics;Cooling;Polymers;Packaging;Heat transfer;Etching;Resistance heating;Thermal resistance;Microfluidic heatsink;thermal-fluidic input/output (I/O) interconnects},
doi={10.1109/LED.2005.862693},
ISSN={1558-0563},
month={Feb},}