@article{abbaspour2017fabrication,
  title={Fabrication and electrical characterization of sub-micron diameter through-silicon via for heterogeneous three-dimensional integrated circuits},
  author={Abbaspour, R and Brown, DK and Bakir, MS},
  journal={Journal of Micromechanics and Microengineering},
  volume={27},
  number={2},
  pages={025011},
  year={2017},
  publisher={IOP Publishing}
}