'@ARTICLE{11157889,
  author={Chung, Euichul and Bakir, Muhannad S.},
  journal={IEEE Transactions on Components, Packaging and Manufacturing Technology}, 
  title={Integrated Microfluidic Cooling of Heterogeneous HBM-GPU Package with Die Height Difference}, 
  year={2025},
  volume={},
  number={},
  pages={1-1},
  keywords={Graphics processing units;Heat sinks;Cooling;Silicon;Microchannels;Microfluidics;Heat transfer;Random access memory;Through-silicon vias;Thermal management;High bandwidth memory;graphics processing units;thermal management;microfluidic cooling},
  doi={10.1109/TCPMT.2025.3605312}}