@article{zhang2017double,
  title={A double-lithography and double-reflow process and application to multi-pitch multi-height mechanical flexible interconnects},
  author={Zhang, Chaoqi and Yang, Hyung Suk and Bakir, Muhannad S},
  journal={Journal of Micromechanics and Microengineering},
  volume={27},
  number={2},
  pages={025014},
  year={2017},
  publisher={IOP Publishing}
}