@ARTICLE{4294183,
author={M. S. {Bakir} and B. {Dang} and O. O. A. {Ogunsola} and R. {Sarvari} and J. D. {Meindl}},
journal={IEEE Transactions on Electron Devices},
title={Electrical and Optical Chip I/O Interconnections for Gigascale Systems},
year={2007},
volume={54},
number={9},
pages={2426-2437},
keywords={integrated circuit interconnections;integrated optoelectronics;optical interconnections;electrical chip I/O interconnection;gigascale system;low-loss microscopic polymer pins;electrical solder-bump fabrication;optical chip I/O interconnection;Optical device fabrication;Optical interconnections;Polymers;Optical polymers;Pins;Optical attenuators;Optical imaging;assembly;input/output (I/O) interconnects;integration;optical interconnects;packaging;polymers},
doi={10.1109/TED.2007.903203},
ISSN={1557-9646},
month={Sep.},}