@ARTICLE{4447318,
author={M. S. {Bakir} and A. L. {Glebov} and M. G. {Lee} and P. A. {Kohl} and J. D. {Meindl}},
journal={IEEE Transactions on Advanced Packaging},
title={Mechanically Flexible Chip-to-Substrate Optical Interconnections Using Optical Pillars},
year={2008},
volume={31},
number={1},
pages={143-153},
keywords={optical interconnections;optical waveguides;flexible chip-to-substrate optical interconnection;optical pillar;optical waveguide;optical coupling efficiency;thermal expansion;Optical interconnections;Optical coupling;Semiconductor device measurement;Optical surface waves;Optical waveguides;Light sources;Thermal expansion;Surface waves;Apertures;Photodetectors;Assembly;compliant interconnects;flip-chip;input/output (I/O);integration;optical interconnects;packaging;polymers;waveguides},
doi={10.1109/TADVP.2007.914976},
ISSN={1557-9980},
month={Feb},}