@article{oh2017heterogeneous,
  title={Heterogeneous Integrated Microsystems With Nontraditional Through-Silicon Via Technologies},
  author={Oh, Hanju and May, Gary S and Bakir, Muhannad S},
  journal={IEEE Transactions on Components, Packaging and Manufacturing Technology},
  volume={7},
  number={4},
  pages={502--510},
  year={2017},
  publisher={IEEE}
}