@article{zhang2016impact,
  title={Impact of on-chip interconnect on the performance of 3-D integrated circuits with through-silicon vias: Part II},
  author={Zhang, Xuchen and Kumar, Vachan and Oh, Hanju and Zheng, Li and May, Gary S and Naeemi, Azad and Bakir, Muhannad S},
  journal={IEEE Transactions on Electron Devices},
  volume={63},
  number={6},
  pages={2510--2516},
  year={2016},
  publisher={IEEE}
}