@article{sarvey2017monolithic,
  title={Monolithic integration of a micropin-fin heat sink in a 28-nm FPGA},
  author={Sarvey, Thomas E and Zhang, Yang and Cheung, Colman and Gutala, Ravi and Rahman, Arifur and Dasu, Aravind and Bakir, Muhannad S},
  journal={IEEE Transactions on Components, Packaging and Manufacturing Technology},
  volume={7},
  number={10},
  pages={1617--1624},
  year={2017},
  publisher={IEEE}
}