@ARTICLE{6122495,
author={H. S. {Yang} and M. S. {Bakir}},
journal={IEEE Transactions on Components, Packaging and Manufacturing Technology},
title={Design, Fabrication, and Characterization of Freestanding Mechanically Flexible Interconnects Using Curved Sacrificial Layer},
year={2012},
volume={2},
number={4},
pages={561-568},
keywords={CMOS integrated circuits;integrated circuit interconnections;micromechanical devices;photolithography;solders;freestanding mechanical flexible interconnection;curved sacrificial layer;microelectromechanical systems chip;complementary metal-oxide semiconductor integrated circuit;3-D integration;signal processing electronics;MFI technology;MEMS chip;CMOS IC;photolithography;conventional flipchip bonder;SU-8 ring structures;solder ball;size 20 mum;Resists;Micromechanical devices;CMOS integrated circuits;Stress;Fabrication;Shape;Substrates;3-D integration;flexible interconnects;microelectromechanical systems/sensors integration;packaging},
doi={10.1109/TCPMT.2011.2177462},
ISSN={2156-3985},
month={April},}