@article{zhang2017power,
  title={Power delivery network benchmarking for interposer and bridge-chip-based 2.5-d integration},
  author={Zhang, Yang and Hossen, Md Obaidul and Bakir, Muhannad S},
  journal={IEEE Electron Device Letters},
  volume={39},
  number={1},
  pages={99--102},
  year={2017},
  publisher={IEEE}
}