@article{jo2018heterogeneous,
  title={Heterogeneous multi-die stitching enabled by fine-pitch and multi-height compressible microinterconnects (CMIs)},
  author={Jo, Paul K and Zhang, Xuchen and Gonzalez, Joe L and May, Gary S and Bakir, Muhannad S},
  journal={IEEE Transactions on Electron Devices},
  volume={65},
  number={7},
  pages={2957--2963},
  year={2018},
  publisher={IEEE}
}