@ARTICLE{6523083,
author={P. A. {Thadesar} and M. S. {Bakir}},
journal={IEEE Transactions on Components, Packaging and Manufacturing Technology},
title={Novel Photo-Defined Polymer-Enhanced Through-Silicon Vias for Silicon Interposers},
year={2013},
volume={3},
number={7},
pages={1130-1137},
keywords={copper;optical interconnections;optical polymers;silicon;three-dimensional integrated circuits;photodefined polymer-enhanced through-silicon vias;optical TSV;polymer-clad TSV;silicon interposer interconnection;polymer-embedded vias;polymer wells;chip-to-motherboard optical access;optical loss measurements;wavelength 850 nm;Electrical loss measurements;electrical resistance measurements;lithography;optical interconnections;optical loss measurements;through-silicon vias (TSVs)},
doi={10.1109/TCPMT.2013.2261122},
ISSN={2156-3985},
month={July},}