@article{liu2013thermomechanical, title={Thermomechanical strain measurements by synchrotron x-ray diffraction and data interpretation for through-silicon vias}, author={Liu, X and Thadesar, PA and Taylor, CL and Kunz, M and Tamura, N and Bakir, MS and Sitaraman, SK}, journal={Applied Physics Letters}, volume={103}, number={2}, pages={022107}, year={2013}, publisher={AIP} }