@INPROCEEDINGS{8534267,
author={M. {Obaidul Hossen} and Y. {Zhang} and M. S. {Bakir}},
booktitle={2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)},
title={Thermal-Power Delivery Network Co-Analysis for Multi-Die Integration},
year={2018},
volume={},
number={},
pages={155-157},
keywords={circuit noise;integrated circuit design;integrated circuit noise;integrated circuit packaging;power supply circuits;temperature distribution;multidie integration;thermal-power delivery network co-analysis framework;integration schemes;supply voltage noise;PDN analyses;package case studies;steady-state temperature;power supply noise;temperature distribution;standalone thermal analyses;bridge-based 2.5-D package;Co;Field programmable gate arrays;Analytical models;Heat sinks;Bridge circuits;Thermal analysis;Electronic packaging thermal management;Steady-state;2.5-D/3-D interconnects and packages;heterogeneous integration;power distribution networks},
doi={10.1109/EPEPS.2018.8534267},
ISSN={2165-4107},
month={Oct},}