@article{liu2016experimental,
  title={Experimental Stress Characterization and Numerical Simulation for Copper Pumping Analysis of Through-Silicon Vias},
  author={Liu, Xi and Thadesar, Paragkumar A and Taylor, Christine L and Kunz, Martin and Tamura, Nobumichi and Bakir, Muhannad S and Sitaraman, Suresh K},
  journal={IEEE Transactions on Components, Packaging and Manufacturing Technology},
  volume={6},
  number={7},
  pages={993--999},
  year={2016},
  publisher={IEEE}
}