@ARTICLE{1232922, author={M. S. {Bakir} and H. A. {Reed} and H. D. {Thacker} and C. S. {Patel} and P. A. {Kohl} and K. P. {Martin} and J. D. {Meindl}}, journal={IEEE Transactions on Electron Devices}, title={Sea of Leads (SoL) ultrahigh density wafer-level chip input/output interconnections for gigascale integration (GSI)}, year={2003}, volume={50}, number={10}, pages={2039-2048}, keywords={integrated circuit interconnections;polymer films;ULSI;micromechanical devices;chip scale packaging;fine-pitch technology;indentation;microassembling;sea of leads;gigascale integration;GSI;ultrahigh density interconnections;wafer-level chip input/output interconnections;packaging;SoL fabrication;mechanical performance;electrical performance;wafer-level testing;in-plane compliance;mechanically compliant I/O leads;microindentation experiments;polymer film;embedded air gaps;Integrated circuit interconnections;Plastic films;Ultra-large-scale integration;Microelectromechanical devices;Microassembly}, doi={10.1109/TED.2003.816528}, ISSN={1557-9646}, month={Oct},}