@article{thadesar2016through,
  title={Through-silicon vias: drivers, performance, and innovations},
  author={Thadesar, Paragkumar A and Gu, Xiaoxiong and Alapati, Ramakanth and Bakir, Muhannad S},
  journal={IEEE Transactions on Components, Packaging and Manufacturing Technology},
  volume={6},
  number={7},
  pages={1007--1017},
  year={2016},
  publisher={IEEE}
}