@ARTICLE{1237590,
author={M. S. {Bakir} and T. K. {Gaylord} and K. P. {Martin} and J. D. {Meindl}},
journal={IEEE Photonics Technology Letters},
title={Sea of polymer pillars: compliant wafer-level electrical-optical chip I/O interconnections},
year={2003},
volume={15},
number={11},
pages={1567-1569},
keywords={optical interconnections;optical polymers;integrated optoelectronics;optical planar waveguides;integrated circuit interconnections;printed circuit accessories;thermal management (packaging);optical couplers;diffraction gratings;compliant wafer-level electrical-optical chip I/O interconnections;sea of polymer pillars;electrical-optical chip input-output interconnection technology;highly process-integrated die-to-board interconnections;mechanically flexible electrical-optical die-to-board interconnections;thermo-mechanical expansion mismatches;input optical coupling efficiency;I/O density;volume grating coupler;optical polymers;50 percent;Optical polymers;Optical waveguides;Optical interconnections;Optical refraction;Optical coupling;Scanning electron microscopy;Sockets;Optical surface waves;Electron optics;Surface waves},
doi={10.1109/LPT.2003.818651},
ISSN={1941-0174},
month={Nov},}