@INPROCEEDINGS{7517533,
author={ {Yaqin Song} and R. {Abbaspour} and M. S. {Bakir} and S. K. {Sitaraman}},
booktitle={2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)},
title={Thermal annealing effects on copper microstructure in Through-Silicon-Vias},
year={2016},
volume={},
number={},
pages={91-95},
keywords={annealing;electron backscattering;electron diffraction;grain growth;nanoindentation;three-dimensional integrated circuits;thermal annealing effects;copper microstructure;through-silicon-vias;nanoindentation technique;electron backscatter diffraction;grain growth;temperature 300 degC;temperature 400 degC;temperature 500 degC;time 180 min;Annealing;Copper;Through-silicon vias;Aging;Microstructure;Silicon;Grain size;EBSD;electroplated copper;microstructure evolution;nano-indentation;thermal annealing;TSV},
doi={10.1109/ITHERM.2016.7517533},
ISSN={1087-9870},
month={May},}