@inproceedings{bakir2002sea,
  title={Sea of leads ultra high-density compliant wafer-level packaging technology},
  author={Bakir, Muhannad S and Reed, Hollie A and Kohl, Paul A and Martin, Kevin P and Meindl, James D},
  booktitle={52nd Electronic Components and Technology Conference 2002.(Cat. No. 02CH37345)},
  pages={1087--1094},
  year={2002},
  organization={IEEE}
}