@inproceedings{bakir2004chip, title={Chip integration of sea of leads compliant I/O interconnections for the ultimate enabling of chips with low-k interlayer dielectrics}, author={Bakir, Muhannad S and Dang, Bing and Emery, Richard and Vandentop, Gilroy and Martin, Kevin P and Kohl, PA and Meindl, JD}, booktitle={2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No. 04CH37546)}, volume={1}, pages={1167--1173}, year={2004}, organization={IEEE} }