@inproceedings{bakir2004integrated,
  title={Integrated electrical, optical, and thermal high density and compliant wafer-level chip I/O interconnections for gigascale integration},
  author={Bakir, Muhannad S and Meindl, James D},
  booktitle={2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No. 04CH37546)},
  volume={1},
  pages={1--6},
  year={2004},
  organization={IEEE}
}