@INPROCEEDINGS{1363373, author={M. S. {Bakir} and J. D. {Meindl}}, booktitle={The 17th Annual Meeting of the IEEELasers and Electro-Optics Society, 2004. LEOS 2004.}, title={Wafer-level packaging of optoelectronic chips using sea of leads electrical and optical I/O interconnections}, year={2004}, volume={2}, number={}, pages={583-584 Vol.2}, keywords={packaging;integrated optoelectronics;optical interconnections;wafer-level packaging;optoelectronic chips;sea of leads;electrical interconnections;optical interconnections;I/O interconnections;SoL processing;process integration;optoelectronic devices;optical characteristics;electrical characteristics;mechanical characteristics;Wafer scale integration;Optical interconnections;Optical polymers;Optical films;Assembly;Packaging;Optical devices;Bandwidth;Mirrors;Optical coupling}, doi={10.1109/LEOS.2004.1363373}, ISSN={null}, month={Nov},}