@article{bakir_reed_mulé_jayachandran_kohl_martin_gaylord_meindl_2003, title={Chip-to-Module Interconnections Using “Sea of Leads” Technology}, volume={28}, DOI={10.1557/mrs2003.19}, number={1}, journal={MRS Bulletin}, publisher={Cambridge University Press}, author={Bakir, Muhannad S. and Reed, Hollie A. and Mulé, Anthony V. and Jayachandran, Joseph Paul and Kohl, Paul A. and Martin, Kevin P. and Gaylord, Thomas K. and Meindl, James D.}, year={2003}, pages={61–67}}