@ARTICLE{9600848,
  author={Li, Ming-Jui and Bakir, Muhannad S.},
  journal={IEEE Transactions on Components, Packaging and Manufacturing Technology}, 
  title={3-D Integrated Chiplet Encapsulation (3-D ICE): High-Density Heterogeneous Integration Using SiO<sub>2</sub>-Reconstituted Tiers}, 
  year={2021},
  volume={11},
  number={12},
  pages={2242-2245},
  doi={10.1109/TCPMT.2021.3125338}}