@proceedings{Proc. IMAPS Int. Symp. on Microelectronics},
    author = {Dang, Bing and and Bakir, Muhannad S. and Martin, Kevin P. and Meindl, James D.},
    title = "{Assembly and reliability assessment of Sea-of-Leads compliant wafer level package}",
    volume = {null},
    series = {null},
    pages = {7-14},
    year = {2004},
    month = {07},
    abstract = {null}
    doi = {null},
    url = {null},
    eprint = {null} 
}