@proceedings{10.1115/IPACK2005-73416,
    author = {Dang, Bing and Joseph, Paul J. and Wei, Xiaojin and Bakir, Muhannad S. and Kohl, Paul A. and Joshi, Yogendra K. and Meindl, James D.},
    title = "{A Chip-Scale Cooling Scheme With Integrated Heat Sink and Thermal-Fluidic I/O Interconnects}",
    volume = {Advances in Electronic Packaging, Parts A, B, and C},
    series = {International Electronic Packaging Technical Conference and Exhibition},
    pages = {605-610},
    year = {2005},
    month = {07},
    abstract = "{We demonstrate a prototype chip-scale microfluidic cooling scheme. CMOS compatible processes allow the monolithic integration of the microchannel heat sink into the backside of a Si chip at low temperature (≤260°C). At the front side of a chip, fine pitch area-array solder bumps are fabricated by electroplating for high-density electrical I/O interconnection, while a peripheral array of micro polymer pipes are fabricated as thermal-fluidic I/O interconnects. The resulting “microfluidic flip chip” can be bonded onto a liquid-cooled board substrate using conventional flip-chip assembly processes. The cooling liquid can, therefore, be transferred into a Si chip directly from the board-level manifolds to alleviate the thermal interface issues.   This paper was also originally published as part of the Proceedings of the ASME 2005 Heat Transfer Summer Conference.}",
    doi = {10.1115/IPACK2005-73416},
    url = {https://doi.org/10.1115/IPACK2005-73416},
    eprint = {https://asmedigitalcollection.asme.org/InterPACK/proceedings-pdf/InterPACK2005/42002/605/4531483/605\_1.pdf},
}