@proceedings{10.1115/IPACK2005-73416, author = {Dang, Bing and Joseph, Paul J. and and Bakir, Muhannad S. and Kohl, Paul A. and Joshi, Yogendra K. and Meindl, James D.}, title = "{A chip-scale cooling scheme with on-chip heat sink and integrated microfluidic I/O interconnects}", volume = {Proc. SRC TECHCON}, series = {SRC TECHCON}, pages = {null}, year = {2005}, month = {null}, abstract = {null} doi = {null}, url = {null}, eprint = {null}, }