@inproceedings{dembla2012fine,
  title={Fine pitch TSV integration in silicon micropin-fin heat sinks for 3D ICs},
  author={Dembla, Ashish and Zhang, Yue and Bakir, Muhannad S},
  booktitle={2012 IEEE International Interconnect Technology Conference},
  pages={1--3},
  year={2012},
  organization={IEEE}
}