@inproceedings{dembla2012high,
  title={High aspect ratio TSVs in micropin-fin heat sinks for 3D ICs},
  author={Dembla, Ashish and Zhang, Yue and Bakir, Muhannad S},
  booktitle={2012 12th IEEE International Conference on Nanotechnology (IEEE-NANO)},
  pages={1--6},
  year={2012},
  organization={IEEE}
}