@article{hossen2018thermomechanical,
  title={Thermomechanical Analysis and Package-Level Optimization of Mechanically Flexible Interconnects for Interposer-on-Motherboard Assembly},
  author={Hossen, Md Obaidul and Gonzalez, Joe L and Bakir, Muhannad S},
  journal={IEEE Transactions on Components, Packaging and Manufacturing Technology},
  volume={8},
  number={12},
  pages={2081--2089},
  year={2018},
  publisher={IEEE}
}