@article{Lai_2010,
	doi = {10.1088/0960-1317/20/2/025016},
	url = {https://doi.org/10.1088%2F0960-1317%2F20%2F2%2F025016},
	year = 2010,
	month = {jan},
	publisher = {{IOP} Publishing},
	volume = {20},
	number = {2},
	pages = {025016},
	author = {Jiun-Hong Lai and Hyung Suk Yang and Hang Chen and Calvin R King and Jesal Zaveri and Ramasamy Ravindran and Muhannad S Bakir},
	title = {A `mesh' seed layer for improved through-silicon-via fabrication},
	journal = {Journal of Micromechanics and Microengineering},
	abstract = {This paper describes an improved method of forming and removing seed layers for through-silicon-vias (TSVs) in applications such as MEMS, sensors and packaging (silicon carrier, for example). A ‘mesh seed layer’ is proposed to reduce the pinch-off time and facilitate simpler and mechanical-free removal, the latter being possibly important when sensitive MEMS/sensor devices are pre-fabricated on the wafer. As a result, the proposed process may serve as a post-MEMS/sensor method of forming TSVs.}
}