@inproceedings{jo2017dense,
  title={Dense and highly elastic compressible microinterconnects (CMIs) for electronic microsystems},
  author={Jo, Paul K and Zia, Muneeb and Gonzalez, Joe L and Bakir, Muhannad S},
  booktitle={2017 IEEE 67th Electronic Components and Technology Conference (ECTC)},
  pages={684--689},
  year={2017},
  organization={IEEE}
}