@inproceedings{king2010electrical,
  title={Electrical and fluidic C4 interconnections for inter-layer liquid cooling of 3D ICs},
  author={King, Calvin R and Zaveri, Jesal and Bakir, Muhannad S and Meindl, James D},
  booktitle={2010 Proceedings 60th Electronic Components and Technology Conference (ECTC)},
  pages={1674--1681},
  year={2010},
  organization={IEEE}
}