@ARTICLE{9238009,
  author={M. -J. {Li} and M. {Breeden} and V. {Wang} and J. {Hollin} and N. M. K. {Linn} and C. H. {Winter} and A. {Kummel} and M. S. {Bakir}},
  journal={IEEE Transactions on Components, Packaging and Manufacturing Technology}, 
  title={Cu–Cu Bonding Using Selective Cobalt Atomic Layer Deposition for 2.5-D/3-D Chip Integration Technologies}, 
  year={2020},
  volume={10},
  number={12},
  pages={2125-2128},
  doi={10.1109/TCPMT.2020.3033257}}