@INPROCEEDINGS{7334621,
author={H. {Oh} and G. S. {May} and M. S. {Bakir}},
booktitle={2015 International 3D Systems Integration Conference (3DIC)},
title={Silicon interposer platform with low-loss through-silicon vias using air},
year={2015},
volume={},
number={},
pages={TS11.3.1-TS11.3.4},
keywords={elemental semiconductors;etching;integrated circuit interconnections;silicon;three-dimensional integrated circuits;silicon interposer platform;low-loss through-silicon vias;partially etching silicon;ground TSVs;high-frequency characterization;air;frequency 10 MHz to 20 GHz;Si;Through-silicon vias;Silicon;Capacitance;Semiconductor device reliability;Crosstalk;Three dimensional integration;Silicon interposer;Packaging;Through-silicon via (TSV);Low-loss TSVs},
doi={10.1109/3DIC.2015.7334621},
ISSN={null},
month={Aug},}