@INPROCEEDINGS{7545413,
author={H. {Oh} and X. {Zhang} and G. S. {May} and M. S. {Bakir}},
booktitle={2016 IEEE 66th Electronic Components and Technology Conference (ECTC)},
title={High-Frequency Analysis of Embedded Microfluidic Cooling within 3-D ICs Using a TSV Testbed},
year={2016},
volume={},
number={},
pages={68-73},
keywords={cooling;heat sinks;integrated circuit testing;isolation technology;microfluidics;thermal management (packaging);three-dimensional integrated circuits;water;high-frequency analysis;embedded microfluidic cooling;3-D IC;TSV testbed;through-silicon vias;three-dimensional integrated circuits;heat sinks;deionized water;coaxially shielded TSV;pin-fin heat sink;electrical isolation;Through-silicon vias;Heat sinks;Microfluidics;Silicon;Microchannels;Water heating;3-D IC;Heat Sink;Microchannel;Micropin-Fin;Microfluidic Cooling;Silicon Interposer;Through-silicon Via},
doi={10.1109/ECTC.2016.336},
ISSN={null},
month={May},}