@inproceedings{parekh2011electrical,
  title={Electrical, optical and fluidic through-silicon vias for silicon interposer applications},
  author={Parekh, Mahavir S and Thadesar, Paragkumar A and Bakir, Muhannad S},
  booktitle={2011 IEEE 61st Electronic Components and Technology Conference (ECTC)},
  pages={1992--1998},
  year={2011},
  organization={IEEE}
}