@inproceedings{reed2001compliant,
  title={Compliant wafer level package (CWLP) with embedded air-gaps for sea of leads (SoL) interconnections},
  author={Reed, Hollie A and Bakir, Muhannad S and Patel, Chimg S and Martin, Kevin P and Meindl, James D and Kohl, Paul A},
  booktitle={Proceedings of the IEEE 2001 International Interconnect Technology Conference (Cat. No. 01EX461)},
  pages={151--153},
  year={2001},
  organization={IEEE}
}