@INPROCEEDINGS{9058840,  author={S. K. {Rajan} and M. J. {Li} and M. S. {Bakir} and G. S. {May}},  booktitle={2019 International 3D Systems Integration Conference (3DIC)},  title={High Density and Low-Temperature Interconnection Enabled by Mechanical Self-Alignment and Electroless Plating},   year={2019},  volume={},  number={},  pages={1-4},  abstract={In this work, we propose and demonstrate the use of metal electroless plating along with mechanical self-alignment as a method to create high density scalable interconnects between chiplets using a low temperature process flow. Void free and selective bonding of a copper pillar array at 50 ^m pitch using electroless nickel deposition is demonstrated at a temperature of 95°C and atmospheric pressure. Mechanical self-alignment using precision ruby balls is demonstrated to attain alignment accuracies within 2 μm.},  keywords={Die-to-die bonding;electroless plating;selfalignment},  doi={10.1109/3DIC48104.2019.9058840},  ISSN={},  month={Oct},}