@INPROCEEDINGS{7338365,
author={T. E. {Sarvey} and Y. {Zhang} and L. {Zheng} and P. {Thadesar} and R. {Gutala} and C. {Cheung} and A. {Rahman} and M. S. {Bakir}},
booktitle={2015 IEEE Custom Integrated Circuits Conference (CICC)},
title={Embedded cooling technologies for densely integrated electronic systems},
year={2015},
volume={},
number={},
pages={1-8},
keywords={cooling;heat sinks;integrated circuit design;integrated circuit interconnections;microfluidics;polymers;thermal management (packaging);three-dimensional integrated circuits;vias;embedded cooling technology;densely integrated electronic systems;thermal management technology;interconnect technology;low-loss polymer-embedded vias;fluidic I/Os;microfluidic heat sinks;3D stacks;assembled 2.5D stacks;thermal coupling;3D systems;2.5D systems;microfluidic cooling utility;FPGA;monolithically integrated microfluidic heat sink;size 28 nm;Heat sinks;Silicon;Three-dimensional displays;Polymers;Couplings;X-ray imaging},
doi={10.1109/CICC.2015.7338365},
ISSN={null},
month={Sep.},}