@inproceedings{thacker2005probe,
  title={Probe module for wafer-level testing of gigascale chips with electrical and optical I/O interconnects},
  author={Thacker, Hiren and Ogunsola, Oluwafemi and Bakir, Muhannad and Meindl, James},
  booktitle={ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference},
  pages={1593--1599},
  year={2005},
  organization={American Society of Mechanical Engineers Digital Collection}
}