@article{wan2019fiber, title={Fiber-Interconnect Silicon Chiplet Technology for Self-Aligned Fiber-to-Chip Assembly}, author={Wan, Congshan and Gonzalez, Joe L and Fan, Tianren and Adibi, Ali and Gaylord, Thomas K and Bakir, Muhannad S}, journal={IEEE Photonics Technology Letters}, volume={31}, number={16}, pages={1311--1314}, year={2019}, publisher={IEEE} }