@inproceedings{yang20103d,
  title={A 3D interconnect system for large biosensor array and CMOS signal-processing IC integration},
  author={Yang, Hyung Suk and Ravindran, Ramasamy and Bakir, Muhannad S and Meindl, James D},
  booktitle={2010 IEEE International Interconnect Technology Conference},
  pages={1--3},
  year={2010},
  organization={IEEE}
}