@inproceedings{zhang2011coupled,
  title={Coupled electrical and thermal 3D IC centric microfluidic heat sink design and technology},
  author={Zhang, Yue and King, Calvin R and Zaveri, Jesal and Kim, Yoon Jo and Sahu, Vivek and Joshi, Yogenda and Bakir, Muhannad S},
  booktitle={2011 IEEE 61st electronic components and technology conference (ECTC)},
  pages={2037--2044},
  year={2011},
  organization={IEEE}
}